Four-channel bidirectional voltage level translator, CMOS, AVC logic family, with 3-state outputs. Features a 16-pin Thin Shrink Small Outline Package (TSSOP) with gull-wing leads for surface mounting. Package dimensions are 5.1mm x 4.5mm x 0.95mm with a 0.65mm pin pitch. Operates across a temperature range of -40°C to 125°C.
PackageTSSOP
MountingSurface Mount
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Technical Specifications
Nexperia 74AVCH4T245PW,118 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
5.1(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Package Orientation
Yes
Package Orientation Marking Type
Dot
Jedec
MO-153
Logic Family
AVC
Logic Function
Voltage Level Translator
Process Technology
CMOS
Output Type
3-State
Maximum Low Level Output Current
12mA
Maximum High Level Output Current
-12mA
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
H2HX9
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Nexperia 74AVCH4T245PW,118 Datasheet
Download the complete datasheet for Nexperia 74AVCH4T245PW,118 to view detailed technical specifications.
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