Four-channel bidirectional voltage level translator, CMOS, AVC logic family, with 3-state outputs. Features a 16-pin Thin Shrink Small Outline Package (TSSOP) with gull-wing leads for surface mounting. Package dimensions are 5.1mm x 4.5mm x 0.95mm with a 0.65mm pin pitch. Operates across a temperature range of -40°C to 125°C.
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| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 5.1(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Package Orientation | Yes |
| Package Orientation Marking Type | Dot |
| Jedec | MO-153 |
| Logic Family | AVC |
| Logic Function | Voltage Level Translator |
| Process Technology | CMOS |
| Output Type | 3-State |
| Maximum Low Level Output Current | 12mA |
| Maximum High Level Output Current | -12mA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
| Cage Code | H2HX9 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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