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Technical Specifications
NXP 74CBTLV1G125GF,132 technical specifications.
General
| Contact Plating | Tin |
| High Level Output Current | -128mA |
| Independent Circuits | 1 |
| Lead Free | Lead Free |
| Low Level Output Current | 128mA |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| Max Power Dissipation | 250mW |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 2.3V |
| Mount | Surface Mount |
| Number of Bits | 1 |
| Number of Elements | 1 |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Propagation Delay | 6.3ns |
| Quiescent Current | 200uA |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Series | 74CBTLV |
| Supply Current | 50mA |
| Supply Type | Single |
| Supply Voltage-Nom | 3.6V |
| Technology | CMOS |
| Turn-On Delay Time | 6.3ns |
Compliance
| RoHS | Compliant |
Datasheet
NXP 74CBTLV1G125GF,132 Datasheet
Download the complete datasheet for NXP 74CBTLV1G125GF,132 to view detailed technical specifications.
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