PackageDIP
MountingThrough Hole
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Technical Specifications
NXP 74HC30N technical specifications.
General
Package/Case
DIP
Height
3.2mm
High Level Output Current
-5.2mA
Lead Free
Lead Free
Length
19.5mm
Logic Function
NAND GATE
Low Level Output Current
5.2mA
Max Operating Temperature
125°C
Min Operating Temperature
-40°C
Max Supply Voltage
6V
Min Supply Voltage
2V
Mount
Through Hole
Number of Circuits
1
Number of Elements
1
Number of Inputs
8
Number of Outputs
1
Operating Supply Voltage
5V
Output Current
5.2mA
Output Type
Voltage
Packaging
Bulk
Propagation Delay
33ns
Quiescent Current
2uA
Radiation Hardening
No
Reach SVHC Compliant
No
RoHS Compliant
Yes
Schmitt Trigger Input
No
Technology
CMOS
Turn-On Delay Time
33ns
Width
6.48mm
Compliance
RoHS
Compliant
Datasheet
NXP 74HC30N Datasheet
Download the complete datasheet for NXP 74HC30N to view detailed technical specifications.
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