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Technical Specifications
NXP BAW56T115 technical specifications.
General
| Average Rectified Current | 150mA |
| Package/Case | SC |
| Forward Current | 150mA |
| Height | 0.85mm |
| Lead Free | Lead Free |
| Length | 1.8mm |
| Max Forward Surge Current (Ifsm) | 4A |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Repetitive Reverse Voltage (Vrrm) | 90V |
| Max Reverse Leakage Current | 500nA |
| Max Reverse Voltage (DC) | 90V |
| Max Surge Current | 4A |
| Mount | Surface Mount |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Peak Non-Repetitive Surge Current | 4A |
| Power Dissipation | 170mW |
| Radiation Hardening | No |
| Reach SVHC Compliant | No |
| Reverse Recovery Time | 4ns |
| Reverse Recovery Time-Max | 4ns |
| Termination | SMD/SMT |
| Width | 0.9mm |
Compliance
| RoHS | Compliant |
Datasheet
NXP BAW56T115 Datasheet
Download the complete datasheet for NXP BAW56T115 to view detailed technical specifications.
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