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Technical Specifications
NXP BB153115 technical specifications.
General
| Capacitance | 34.65pF |
| Contact Plating | Tin |
| Diode Capacitance-Max | 42.35pF |
| Height | 1.05mm |
| Lead Free | Lead Free |
| Length | 1.8mm |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Mount | Surface Mount |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| Reverse Voltage (DC) | 32V |
| Series | C1/C28 |
| Width | 1.35mm |
Compliance
| RoHS | Compliant |
Datasheet
NXP BB153115 Datasheet
Download the complete datasheet for NXP BB153115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.