Sign in to ask questions about the NXP BZB84-C39,215 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
NXP BZB84-C39,215 technical specifications.
| Package/Case | TO-236-3 |
| Contact Plating | Tin |
| ESD Protection | No |
| Impedance | 130R |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| Max Power Dissipation | 300mW |
| Max Reverse Leakage Current | 50nA |
| Mount | Surface Mount |
| Package Quantity | 3000 |
| Packaging | Tape and Reel |
| RoHS Compliant | Yes |
| Tolerance | 5% |
| Zener Voltage | 39V |
| RoHS | Compliant |
Download the complete datasheet for NXP BZB84-C39,215 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
