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NXP BZV55-C75,135 technical specifications.
| Contact Plating | Tin |
| ESD Protection | No |
| Impedance | 255R |
| Max Operating Temperature | 200°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 500mW |
| Max Reverse Leakage Current | 50nA |
| Mount | Surface Mount |
| Package Quantity | 10000 |
| Packaging | Tape and Reel |
| Power Dissipation | 500mW |
| RoHS Compliant | Yes |
| Tolerance | 5% |
| Voltage | 75V |
| Voltage Tolerance | 5% |
| Zener Voltage | 74.5V |
| RoHS | Compliant |
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