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NXP BZX585-B2V4,135 technical specifications.
| Package/Case | SC |
| Contact Plating | Tin |
| ESD Protection | No |
| Impedance | 100R |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 300mW |
| Max Reverse Leakage Current | 50uA |
| Mount | Surface Mount |
| Package Quantity | 10000 |
| Packaging | Tape and Reel |
| Power Dissipation | 300mW |
| RoHS Compliant | Yes |
| Tolerance | 2% |
| Voltage Tolerance | 2% |
| Zener Voltage | 2.4V |
| RoHS | Compliant |
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