PackageSC
Power300mW
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Technical Specifications
NXP BZX585-B56,115 technical specifications.
General
| Package/Case | SC |
| Impedance | 200R |
| Lead Free | Lead Free |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Reverse Leakage Current | 50nA |
| Package Quantity | 3000 |
| Packaging | Tape and Reel |
| Power Dissipation | 300mW |
| RoHS Compliant | Yes |
| Voltage Tolerance | 2% |
| Zener Voltage | 56V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BZX585-B56,115 Datasheet
Download the complete datasheet for NXP BZX585-B56,115 to view detailed technical specifications.
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