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Technical Specifications
NXP BZX585-C56,115 technical specifications.
General
| Package/Case | SC |
| Contact Plating | Tin |
| ESD Protection | No |
| Impedance | 200R |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 300mW |
| Max Reverse Leakage Current | 50nA |
| Mount | Surface Mount |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Power Dissipation | 300mW |
| RoHS Compliant | Yes |
| Tolerance | 5% |
| Voltage Tolerance | 5% |
| Zener Voltage | 56V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BZX585-C56,115 Datasheet
Download the complete datasheet for NXP BZX585-C56,115 to view detailed technical specifications.
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