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Technical Specifications
NXP BZX884-B22,315 technical specifications.
General
| Package/Case | DFN |
| Contact Plating | Tin |
| ESD Protection | Yes |
| Impedance | 55R |
| Lead Free | Lead Free |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 250mW |
| Max Reverse Leakage Current | 50nA |
| Mount | Surface Mount |
| Package Quantity | 1 |
| Packaging | Tape and Reel |
| Power Dissipation | 250mW |
| RoHS Compliant | Yes |
| Tolerance | 2% |
| Voltage Tolerance | 2% |
| Zener Voltage | 22V |
Compliance
| RoHS | Compliant |
Datasheet
NXP BZX884-B22,315 Datasheet
Download the complete datasheet for NXP BZX884-B22,315 to view detailed technical specifications.
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