PackageHVQFN EP
MountingSurface Mount
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Technical Specifications
NXP CLRC66302HN,157 technical specifications.
General
Package/Case
HVQFN EP
Pin Count
32
PCB
32
Package Length (mm)
5.1(Max)
Package Width (mm)
5.1(Max)
Package Height (mm)
0.95(Max)
Mounting
Surface Mount
Jedec
MO-220
Module/IC Classification
IC
Operation
Read/Write
Memory Size
8KByte
Frequency Range
13.56(Typ)MHz
Covered Range
120mm
Max Operating Supply Voltage
5.5V
Min Operating Temperature
-25°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
5A992
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP CLRC66302HN,157 Datasheet
Download the complete datasheet for NXP CLRC66302HN,157 to view detailed technical specifications.
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