PackageDIP
MountingThrough Hole
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Technical Specifications
NXP HEF4023BP technical specifications.
General
Package/Case
DIP
Height
3.2mm
Length
19.5mm
Logic Function
NAND GATE
Max Operating Temperature
70°C
Min Operating Temperature
-40°C
Max Supply Voltage
15.5V
Min Supply Voltage
4.5V
Mount
Through Hole
Number of Elements
3
Number of Inputs
3
Operating Supply Voltage
15V
Output Current
2.4mA
Output Type
Voltage
Propagation Delay
45ns
Reach SVHC Compliant
No
RoHS Compliant
Yes
Schmitt Trigger Input
No
Termination
Through Hole
Width
6.48mm
Compliance
RoHS
Compliant
Datasheet
NXP HEF4023BP Datasheet
Download the complete datasheet for NXP HEF4023BP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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