PackageHVSON EP
MountingSurface Mount
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Technical Specifications
NXP HTMS1301FTK/AF,115 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
SON
Package/Case
HVSON EP
Package Description
Heat Sinked Very Thin Small Outline No Lead, Exposed Pad
Lead Shape
No Lead
Pin Count
2
PCB
2
Package Length (mm)
3.1(Max)
Package Width (mm)
2.1(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1(Max)
Package Material
Plastic
Mounting
Surface Mount
Technology
Passive
Memory Size
1760bit
Maximum Data Rate
5.2Kbps
Style
IC
Frequency Range
100 to 150kHz
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP HTMS1301FTK/AF,115 Datasheet
Download the complete datasheet for NXP HTMS1301FTK/AF,115 to view detailed technical specifications.
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