PackageXSON
MountingSurface Mount
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Technical Specifications
NXP HTMS8001FTB/AF,148 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
SON
Package/Case
XSON
Package Description
Plastic Extremely Thin Small Outline Package No Lead
Lead Shape
No Lead
Pin Count
3
PCB
3
Package Length (mm)
1
Package Width (mm)
1.45
Package Height (mm)
0.46(Max)
Seated Plane Height (mm)
0.5(Max)
Pin Pitch (mm)
0.55
Package Material
Plastic
Mounting
Surface Mount
Technology
Passive
Memory Size
1760bit
Maximum Data Rate
8Kbps
Style
IC
Frequency Range
100 to 150kHz
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542320071
Schedule B
8542320070
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP HTMS8001FTB/AF,148 Datasheet
Download the complete datasheet for NXP HTMS8001FTB/AF,148 to view detailed technical specifications.
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