
The HTMS8301FTK/AF,115 is a 2-pin surface mount IC with a non-lead-frame SMT package type in the HVSON EP style. It has a maximum package length of 3.1mm, width of 2.1mm, and height of 0.95mm. The IC operates within a temperature range of -40 to 85 degrees Celsius. It is designed for surface mount applications and is made of plastic material.
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| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | SON |
| Package/Case | HVSON EP |
| Package Description | Heat Sinked Very Thin Small Outline No Lead, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 2 |
| PCB | 2 |
| Package Length (mm) | 3.1(Max) |
| Package Width (mm) | 2.1(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Technology | Passive |
| Memory Size | 1760bit |
| Maximum Data Rate | 5.2Kbps |
| Style | IC |
| Frequency Range | 100 to 150kHz |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP HTMS8301FTK/AF,115 to view detailed technical specifications.
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