Quick Jump:
Technical Specifications
NXP HTSFCH5601EV/DH,11 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | Flip-Chip |
| Package/Case | Flip-Chip |
| Package Length (mm) | 35.05(Max) |
| Package Height (mm) | 0.32(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542320071 |
| Schedule B | 8542320070 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP HTSFCH5601EV/DH,11 Datasheet
Download the complete datasheet for NXP HTSFCH5601EV/DH,11 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.