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Technical Specifications
NXP LPC2294JBD144,551 technical specifications.
General
Package/Case
LQFP
Core Architecture
ARM
Interface
I2C, SPI, CAN, SSP, UART, USART, EBI/EMI
Max Operating Temperature
105°C
Memory Size
256KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
112
Oscillator Type
Internal
Package Quantity
60
Packaging
Tray
Peripherals
POR, PWM, WDT
RoHS Compliant
No
Series
LPC2200
Compliance
RoHS
Not Compliant
Datasheet
NXP LPC2294JBD144,551 Datasheet
Download the complete datasheet for NXP LPC2294JBD144,551 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.