PackageLCC
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Technical Specifications
NXP MC68L11E0FNE2 technical specifications.
General
Package/Case
LCC
Interface
SPI, SCI
Max Operating Temperature
70°C
Memory Type
ROMless,
Min Operating Temperature
0°C
Number of I/Os
38
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
POR, WDT
RoHS Compliant
Yes
Series
HC11
Compliance
RoHS
Compliant
Datasheet
NXP MC68L11E0FNE2 Datasheet
Download the complete datasheet for NXP MC68L11E0FNE2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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