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Technical Specifications
NXP MC908JK3MDWE technical specifications.
General
Package/Case
SOIC
Core Architecture
HC08
Max Operating Temperature
125°C
Memory Size
4KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
15
Oscillator Type
External
Packaging
Rail/Tube
Peripherals
POR, PWM, LVD
Series
HC08
Compliance
RoHS
Compliant
Datasheet
NXP MC908JK3MDWE Datasheet
Download the complete datasheet for NXP MC908JK3MDWE to view detailed technical specifications.
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