
Applications Processor, System on Chip (SoC) featuring an ARM926EJ-S core, operating at a maximum clock rate of 400 MHz. This 0.09um process technology device offers 45KB of RAM and supports multimedia applications. It is housed in a 473-pin MAP-BGA package with a 0.8mm pin pitch, measuring 19x19x1.12mm. Connectivity includes Ethernet (MII, 10/100Mbps), I2C (2), SPI (3), UART (6), and USB (3) interfaces. Operating voltage ranges from 1.45V to 1.52V, with an operating temperature range of -40°C to 85°C.
NXP MCIMX27LMJP4A technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | MAP-BGA |
| Package Description | Molded Array Process Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 473 |
| PCB | 473 |
| Package Length (mm) | 19 |
| Package Width (mm) | 19 |
| Package Height (mm) | 1.12 |
| Seated Plane Height (mm) | 1.54(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Weight (g) | 0.9194 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | i.MX21 |
| Device Core | ARM926EJ-S |
| Maximum Clock Rate | 400MHz |
| Program Memory Type | ROMLess |
| Maximum Speed | 400MHz |
| Process Technology | 0.09um |
| RAM Size | 45KB |
| Type | Applications Processor |
| Processing Unit | Microprocessor |
| Max Operating Supply Voltage | 1.52V |
| Typical Operating Supply Voltage | 1.45V |
| Application | Multimedia |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Interface Type | Ethernet/I2C/SPI/UART/USB |
| SPI | 3 |
| I2C | 2 |
| I2S | 0 |
| UART | 6 |
| USB | 3 |
| USART | 0 |
| CAN | 0 |
| Ethernet | 1 |
| Programmability | No |
| Core Architecture | ARM |
| Ethernet Interface Type | MII |
| Ethernet Speed | 10Mbps/100Mbps |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A992.c |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP MCIMX27LMJP4A to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.