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Technical Specifications
NXP MCIMX503CVM8BR2 technical specifications.
General
| Package/Case | LFBGA |
| Core Architecture | ARM |
| Data Bus Width | 32b |
| Interface | I2C, USB, Ethernet |
| Max Frequency | 800MHz |
| Max Operating Temperature | 70°C |
| Memory Type | ROM, L2 Cache |
| Min Operating Temperature | 0°C |
| Number of Cores | 1 |
| Operating Supply Voltage | 1.275V |
| Package Quantity | 1000 |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| RAM Size | 256KB |
| RoHS Compliant | Yes |
| Series | i.MX50 |
| Weight | 0.029584oz |
Compliance
| RoHS | Compliant |
Datasheet
NXP MCIMX503CVM8BR2 Datasheet
Download the complete datasheet for NXP MCIMX503CVM8BR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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