PackageBGA
MountingSurface Mount
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Technical Specifications
NXP MCIMX511DVK8C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
527
PCB
527
Package Length (mm)
13
Package Width (mm)
13
Package Height (mm)
0.96
Seated Plane Height (mm)
1.3(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Type
Applications Processor
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A002
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MCIMX511DVK8C Datasheet
Download the complete datasheet for NXP MCIMX511DVK8C to view detailed technical specifications.
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