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Technical Specifications
NXP MFRC53001T/0FE,118 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SO
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
32
PCB
32
Package Length (mm)
20.7(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.45(Max)
Seated Plane Height (mm)
2.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-119
Module/IC Classification
IC
Operation
Read/Write
Frequency Range
13.56(Typ)MHz
Covered Range
100mm
Max Operating Supply Voltage
5.5V
Min Operating Temperature
-25°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MFRC53001T/0FE,118 Datasheet
Download the complete datasheet for NXP MFRC53001T/0FE,118 to view detailed technical specifications.
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