PackageLQFP
Current8mA
MountingSurface Mount
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Technical Specifications
NXP MM912G634CM1AE technical specifications.
General
Package/Case
LQFP
Core Architecture
HC08
Interface
SPI, SCI
Max Operating Temperature
85°C
Memory Type
FLASH
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
13
Operating Supply Voltage
5V
Package Quantity
250
Packaging
Rail/Tube
RoHS Compliant
Yes
Series
MM912_634
Supply Current
8mA
Weight
0.006871oz
Compliance
RoHS
Compliant
Datasheet
NXP MM912G634CM1AE Datasheet
Download the complete datasheet for NXP MM912G634CM1AE to view detailed technical specifications.
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