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Technical Specifications
NXP P87LPC779FDH,529 technical specifications.
General
Package/Case
TSSOP
Core Architecture
8051
Interface
I2C, UART, USART
Max Operating Temperature
85°C
Memory Size
8KB
Memory Type
OTP,
Min Operating Temperature
-40°C
Number of I/Os
18
Oscillator Type
Internal
Package Quantity
75
Packaging
Rail/Tube
Peripherals
Brown-out Detect/Reset, POR, WDT
RoHS Compliant
No
Series
LPC700
Compliance
RoHS
Not Compliant
Datasheet
NXP P87LPC779FDH,529 Datasheet
Download the complete datasheet for NXP P87LPC779FDH,529 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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