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Technical Specifications
NXP PCIMX511AJM6C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 529 |
| PCB | 529 |
| Package Length (mm) | 19 |
| Package Width (mm) | 19 |
| Package Height (mm) | 1.12 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | Applications Processor |
Compliance
| Cage Code | H1R01 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
NXP PCIMX511AJM6C Datasheet
Download the complete datasheet for NXP PCIMX511AJM6C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.