PackageBGA
MountingSurface Mount
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Technical Specifications
NXP PCIMX511AJM6C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
529
PCB
529
Package Length (mm)
19
Package Width (mm)
19
Package Height (mm)
1.12
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Type
Applications Processor
Compliance
Cage Code
H1R01
HTS Code
8542310001
Schedule B
8542310000
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP PCIMX511AJM6C Datasheet
Download the complete datasheet for NXP PCIMX511AJM6C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.