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Technical Specifications
NXP PK30X128VMD100 technical specifications.
General
| Package/Case | LBGA |
| Core Architecture | ARM |
| Data Bus Width | 32b |
| Halogen Free | Halogen Free |
| Interface | I2C, SPI, CAN, IrDA, SD, UART, USART, EBI/EMI, I2S |
| Max Frequency | 100MHz |
| Max Operating Temperature | 105°C |
| Memory Size | 128KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 102 |
| Number of Timers/Counters | 14 |
| Oscillator Type | Internal |
| Packaging | Tray |
| Peripherals | POR, PWM, WDT, DMA, LVD, LCD |
| Radiation Hardening | No |
| RAM Size | 128KB |
| Series | Kinetis K30 |
Compliance
| RoHS | Compliant |
Datasheet
NXP PK30X128VMD100 Datasheet
Download the complete datasheet for NXP PK30X128VMD100 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.