The PNX1302EH,557 is a 169-channel I2C/SPI bridge from NXP. It features a HBGA package and is designed for surface mount applications. The device operates over a temperature range of 0°C to 85°C. The PNX1302EH,557 is not RoHS compliant.
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NXP PNX1302EH,557 technical specifications.
| Package/Case | HBGA |
| Interface | I2C, Serial, 2-Wire |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Mount | Surface Mount |
| Number of I/Os | 169 |
| Package Quantity | 200 |
| Packaging | Tray |
| RoHS Compliant | No |
| RoHS | Not Compliant |
Download the complete datasheet for NXP PNX1302EH,557 to view detailed technical specifications.
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