Frequency200MHz
PackageTFBGA
Current160mA
MountingSurface Mount
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Technical Specifications
NXP PNX1302EH/G,557 technical specifications.
General
| Package/Case | TFBGA |
| Core Architecture | ARM |
| Interface | SPI, USB, Ethernet, IrDA, MMC, SD, UART, USART, EBI/EMI |
| Lead Free | Lead Free |
| Max Frequency | 200MHz |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Max Power Dissipation | 4.2W |
| Mount | Surface Mount |
| Number of I/Os | 20 |
| Operating Supply Voltage | 2.5V |
| Package Quantity | 200 |
| Packaging | Tray |
| RoHS Compliant | Yes |
| Supply Current | 160mA |
Compliance
| RoHS | Compliant |
Datasheet
NXP PNX1302EH/G,557 Datasheet
Download the complete datasheet for NXP PNX1302EH/G,557 to view detailed technical specifications.
No datasheet is available for this part.