The PNX1302EH/G,557 is a surface mount microcontroller with a core architecture based on ARM. It operates at a maximum frequency of 200MHz and has a maximum operating temperature of 85°C. The device is RoHS compliant and has a maximum power dissipation of 4.2W. It features 20 I/Os and a supply voltage of 2.5V, with a supply current of 160mA. The microcontroller is packaged in a TFBGA package and is available in trays of 200 units.
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NXP PNX1302EH/G,557 technical specifications.
| Package/Case | TFBGA |
| Core Architecture | ARM |
| Interface | SPI, USB, Ethernet, IrDA, MMC, SD, UART, USART, EBI/EMI |
| Lead Free | Lead Free |
| Max Frequency | 200MHz |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Max Power Dissipation | 4.2W |
| Mount | Surface Mount |
| Number of I/Os | 20 |
| Operating Supply Voltage | 2.5V |
| Package Quantity | 200 |
| Packaging | Tray |
| RoHS Compliant | Yes |
| Supply Current | 160mA |
| RoHS | Compliant |
No datasheet is available for this part.
