PackageHVQFN EP
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP PR5331C3HN/C360:55 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
HVQFN EP
Package Description
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad
Lead Shape
No Lead
Pin Count
40
PCB
40
Package Length (mm)
6
Package Width (mm)
6
Package Height (mm)
0.83
Seated Plane Height (mm)
0.85
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220
Module/IC Classification
IC
Operation
Read/Write
Frequency Range
13.56(Typ)MHz
Covered Range
50mm
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-30°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A992
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP PR5331C3HN/C360:55 Datasheet
Download the complete datasheet for NXP PR5331C3HN/C360:55 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.