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NXP PR5331C3HN/C360:55 technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | HVQFN EP |
| Package Description | Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 40 |
| PCB | 40 |
| Package Length (mm) | 6 |
| Package Width (mm) | 6 |
| Package Height (mm) | 0.83 |
| Seated Plane Height (mm) | 0.85 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-220 |
| Module/IC Classification | IC |
| Operation | Read/Write |
| Frequency Range | 13.56(Typ)MHz |
| Covered Range | 50mm |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Temperature | -30°C |
| Max Operating Temperature | 85°C |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A992 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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