Frequency500MHz
PackageBGA
Quick Jump:
Technical Specifications
NXP SPC5516GAMMG66 technical specifications.
General
Package/Case
BGA
Data Bus Width
32b
Interface
I2C, SPI, CAN, SCI
Max Frequency
500MHz
Max Operating Temperature
125°C
Memory Size
1536KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of Timers/Counters
24
Operating Supply Voltage
5.5V
Package Quantity
90
Packaging
Tray
Radiation Hardening
No
RAM Size
80KB
RoHS Compliant
Yes
Weight
0.029239oz
Compliance
RoHS
Compliant
Datasheet
NXP SPC5516GAMMG66 Datasheet
Download the complete datasheet for NXP SPC5516GAMMG66 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.