NXP
TDA19989BET/C1,557
1.8b Resolution, 1.8V Operating, 2.5V Dual Supply, 85°C/400uW TFBGA Surface Mount IC
The TDA19989BET/C1,557 IC from NXP features a 1.8b resolution and operates at 1.8V with a maximum dual supply voltage of 2.5V. It has a maximum power dissipation of 400uW and can withstand temperatures up to 85°C. The IC is packaged in a TFBGA package and is mounted on the surface. It is available in trays containing 2450 units.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
NXP TDA19989BET/C1,557 technical specifications.
General
| Package/Case | TFBGA |
| Max Dual Supply Voltage | 2.5V |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -20°C |
| Max Power Dissipation | 400uW |
| Mount | Surface Mount |
| Operating Supply Voltage | 1.8V |
| Package Quantity | 2450 |
| Packaging | Tray |
| Resolution | 1.8b |
Compliance
| RoHS | Compliant |
Datasheet
NXP TDA19989BET/C1,557 Datasheet
Download the complete datasheet for NXP TDA19989BET/C1,557 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.