PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP TDA8007BHL/C3118 technical specifications.
General
| Package/Case | LQFP |
| Contact Plating | Tin |
| Lead Free | Lead Free |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Packaging | Cut Tape |
| Reach SVHC Compliant | Yes |
| Type | Integrated Circuit (IC) |
Compliance
| RoHS | Compliant |
Datasheet
NXP TDA8007BHL/C3118 Datasheet
Download the complete datasheet for NXP TDA8007BHL/C3118 to view detailed technical specifications.
No datasheet is available for this part.