The TEA1733T/N1 is a flyback converter IC from NXP, designed for single-output applications. It operates within a temperature range of -40°C to 150°C and can handle a maximum power dissipation of 500mW. The device is packaged in a surface-mount SOIC package with dimensions of 1.45mm height, 5mm length, and 4mm width. It can withstand a maximum input voltage of 30V and a maximum supply voltage of 22.6V, while maintaining a minimum supply voltage of 18.6V.
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NXP TEA1733T/N1 technical specifications.
| Package/Case | SOIC |
| Height | 1.45mm |
| Length | 5mm |
| Max Input Voltage | 30V |
| Min Input Voltage | -400mV |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -40°C |
| Max Output Voltage | 12V |
| Min Output Voltage | 9V |
| Max Power Dissipation | 500mW |
| Max Supply Voltage | 22.6V |
| Min Supply Voltage | 18.6V |
| Mount | Surface Mount |
| Number of Outputs | 1 |
| Output Current | 500uA |
| Packaging | Cut Tape |
| Reach SVHC Compliant | No |
| Topology | Flyback |
| Width | 4mm |
| RoHS | Compliant |
Download the complete datasheet for NXP TEA1733T/N1 to view detailed technical specifications.
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