PackageSOIC W
MountingSurface Mount
Power100mW
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Technical Specifications
Onsemi HCPL-0700 technical specifications.
General
Package/Case
SOIC W
Current Transfer Ratio
2600%
Data Rate
0.1Mbps
Fall Time
35us
Forward Current
20mA
Input Type
DC
Isolation Voltage
2.5kV
Isolation Voltage-Max
2.5kV
Lead Free
Lead Free
Max Input Current
20mA
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Output Voltage
7V
Mount
Surface Mount
Number of Channels
1
Number of Elements
1
Packaging
Box
Power Dissipation
100mW
Reverse Breakdown Voltage
5V
Weight
0.252g
Compliance
RoHS
Compliant
Datasheet
Onsemi HCPL-0700 Datasheet
Download the complete datasheet for Onsemi HCPL-0700 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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