PackageDIP
MountingThrough Hole
Power330mW
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Technical Specifications
Onsemi MOC3021TM technical specifications.
General
Package/Case
DIP
Forward Current
60mA
Hold Current
100uA
Isolation Voltage
7.5kV
Lead Free
Lead Free
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Mount
Through Hole
Number of Channels
1
Number of Circuits
1
Number of Elements
1
Package Quantity
1000
Packaging
Bulk
Power Dissipation
330mW
Reverse Breakdown Voltage
3V
RoHS Compliant
Yes
Compliance
RoHS
Compliant
Datasheet
Onsemi MOC3021TM Datasheet
Download the complete datasheet for Onsemi MOC3021TM to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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