PackageDIP
MountingThrough Hole
Power330mW
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Technical Specifications
Onsemi MOC3023VM technical specifications.
General
Package/Case
DIP
Forward Current
60mA
Hold Current
100uA
Isolation Voltage
5.3kV
Lead Free
Lead Free
Max Input Current
60mA
Max Input Voltage
1.5V
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Power Dissipation
330mW
Mount
Through Hole
Nominal Input Voltage
1.15V
Number of Channels
1
Number of Circuits
1
Number of Elements
1
Packaging
Bulk
Power Dissipation
330mW
Radiation Hardening
No
Reverse Breakdown Voltage
3V
RoHS Compliant
Yes
Weight
0.855g
Compliance
RoHS
Compliant
Datasheet
Onsemi MOC3023VM Datasheet
Download the complete datasheet for Onsemi MOC3023VM to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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