PackageDIP
MountingThrough Hole
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Technical Specifications
Onsemi MOC3063TM_F132 technical specifications.
General
| Approvals | UL |
| Package/Case | DIP |
| Hold Current | 500uA |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Mount | Through Hole |
| Number of Channels | 1 |
| Package Quantity | 1000 |
| Packaging | Rail/Tube |
| Weight | 0.030477oz |
Compliance
| RoHS | Compliant |
Datasheet
Onsemi MOC3063TM_F132 Datasheet
Download the complete datasheet for Onsemi MOC3063TM_F132 to view detailed technical specifications.
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