65-00-GEL45-0010

THERM-A-GAP™ GEL 45 is a single-component, fully cured, dispensable thermal interface material designed for high-performance heat transfer in electronic modules. It features a thermal conductivity of 4.5 W/m-K and is optimized for automated dispensing to fill complex geometries and various gap thicknesses. The material requires ultra-low compressive force to deflect, minimizing stress on sensitive components and solder joints. It is room temperature stable and does not require secondary curing, offering ease of rework and long-term reliability in applications such as automotive ECUs, power supplies, and high-speed processors.