Search Results for &quot; bcm20732e infineon technologies ag &quot;

32-bit ARM Core, 512Kb EEPROM, 9-Channel ADC, LGA Package

Volume Production

Package/Case: LGA

Core Architecture: ARM

Data Bus Width: 32b

Height: 1.2mm

Bluetooth 1.2V 32-Pin QFN

Volume Production

Package/Case: SIP

Core Architecture: ARM

Data Bus Width: 32b

Interface: SPI, UART

BCM20736E

48-Pin Industrial Temperature BGA IC

TFLGA,

Obsolete

Max Operating Temperature: 85

Number of Terminals: 48

Min Operating Temperature: -40

Terminal Position: BOTTOM

Telecom Circuit,

Obsolete

Search Results for "bcm20732e infineon technologies ag"

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BCM20732S

32-bit ARM Core, 512Kb EEPROM, 9-Channel ADC, LGA Package

Volume Production

Package/Case: LGA

Core Architecture: ARM

Data Bus Width: 32b

Height: 1.2mm

Bluetooth 1.2V 32-Pin QFN

Volume Production

Package/Case: SIP

Core Architecture: ARM

Data Bus Width: 32b

Interface: SPI, UART

BCM20736E

48-Pin Industrial Temperature BGA IC

TFLGA,

Obsolete

Max Operating Temperature: 85

Number of Terminals: 48

Min Operating Temperature: -40

Terminal Position: BOTTOM

Telecom Circuit,