256Mbit Mobile SDRAM chip, organized as 16Mx16, features a 16-bit data bus and a 15-bit address bus. Operating at a maximum clock rate of 100 MHz, this DRAM chip offers 4 internal banks with 4M words per bank. It is housed in a 54-pin FBGA package with a fine pitch, measuring 13mm x 8mm x 0.8mm, designed for surface mounting. The component operates with a typical supply voltage of 2.5V, with a range of 2.3V to 2.9V, and has a maximum operating current of 70mA. This memory solution is rated for operation between -40°C and 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Promos Technologies V55C2256164VBLC10IPC technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
54
PCB
54
Package Length (mm)
13
Package Width (mm)
8
Package Height (mm)
0.8(Max)
Seated Plane Height (mm)
1.2(Max)
Package Material
Plastic
Mounting
Surface Mount
Density
256Mbit
Type
Mobile SDRAM
Organization
16Mx16
Data Bus Width
16bit
Maximum Clock Rate
100MHz
Number of Internal Banks
4
Number of Words per Bank
4M
Maximum Access Time
22|8|7ns
Density in Bits
268435456bit
Address Bus Width
15bit
Maximum Operating Current
70mA
Typical Operating Supply Voltage
2.5V
Max Operating Supply Voltage
2.9V
Min Operating Supply Voltage
2.3V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
EU RoHS
No
HTS Code
8542320024
Schedule B
8542320015
ECCN
EAR99
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Promos Technologies V55C2256164VBLC10IPC Datasheet
Download the complete datasheet for Promos Technologies V55C2256164VBLC10IPC to view detailed technical specifications.
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