The TQ8213 is a Ball Grid Array logic IC with 208 pins, packaged in a plastic BGA with a 1.27mm pin pitch. It has a seated plane height of 1.65mm and a height of 0.9mm. The IC is designed for surface mount applications.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 208 |
| PCB | 208 |
| Package Length (mm) | 23 |
| Package Width (mm) | 23 |
| Package Height (mm) | 0.9 |
| Seated Plane Height (mm) | 1.65(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | 7AHC2 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
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