
Asynchronous SRAM chip, 128K-bit density, organized as 8K words by 16 bits. Features a maximum access time of 55 ns and operates with a dual 5V supply voltage (4.5V to 5.5V). This surface-mount component utilizes a Ceramic Flat Package (CFPAK) with 84 pins and a 1.27mm pin pitch. Designed for a wide operating temperature range of -55°C to 125°C.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the Renesas 7025L55FGB8 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | FPAK |
| Package/Case | CFPAK |
| Package Description | Ceramic Flat Package |
| Lead Shape | Flat |
| Pin Count | 84 |
| PCB | 84 |
| Package Length (mm) | 29.72(Max) |
| Package Width (mm) | 29.72(Max) |
| Package Height (mm) | 2.67(Max) |
| Seated Plane Height (mm) | 3.56(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Ceramic |
| Mounting | Surface Mount |
| Density | 128Kbit |
| Address Bus Width | 26bit |
| Maximum Access Time | 55ns |
| Timing Type | Asynchronous |
| Data Rate Architecture | SDR |
| Density in Bits | 131072bit |
| Maximum Operating Current | 250mA |
| Typical Operating Supply Voltage | 5V |
| Number of Bits per Word | 16bit |
| Number of Ports | 2 |
| Number of Words | 8K |
| Min Operating Supply Voltage | 4.5V |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
| Cage Code | SAN34 |
| EU RoHS | Yes |
| HTS Code | 8542320041 |
| Schedule B | 8542320040 |
| ECCN | 3A001.a.2.c |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for Renesas 7025L55FGB8 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.