PackageTSSOP
MountingSurface Mount
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Technical Specifications
Renesas 840004BGI-01 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
6.5
Package Width (mm)
4.4
Package Height (mm)
1
Seated Plane Height (mm)
1.1
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AC
Number of Outputs per Chip
4
Input Logic Level
Crystal|LVCMOS|LVTTL
Output Logic Level
LVCMOS|LVTTL
Clock Input Frequency
25(Typ)MHz
Min Operating Supply Voltage
2.375V
Max Operating Supply Voltage
3.465V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
SAN34
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas 840004BGI-01 Datasheet
Download the complete datasheet for Renesas 840004BGI-01 to view detailed technical specifications.
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