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Renesas 840004BGI-01LF technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 6.5 |
| Package Width (mm) | 4.4 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.1 |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153AC |
| Number of Outputs per Chip | 4 |
| Input Logic Level | Crystal|LVCMOS|LVTTL |
| Output Logic Level | LVCMOS|LVTTL |
| Clock Input Frequency | 25(Typ)MHz |
| Min Operating Supply Voltage | 2.375V |
| Max Operating Supply Voltage | 3.465V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | SAN34 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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