PackageTSSOP EP
MountingSurface Mount
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Technical Specifications
Renesas 843246BGI technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP EP
Package Description
Thin Shrink Small Outline Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
24
PCB
24
Package Length (mm)
7.8
Package Width (mm)
4.4
Package Height (mm)
0.9
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AD
Number of Outputs per Chip
6
Input Logic Level
Crystal
Output Logic Level
LVPECL
Clock Input Frequency
25 to 33.333MHz
Min Operating Supply Voltage
3.035/3.135V
Max Operating Supply Voltage
3.465V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
SAN34
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas 843246BGI Datasheet
Download the complete datasheet for Renesas 843246BGI to view detailed technical specifications.
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