10-lane, 4-port PCI Express I/O expansion switch supporting PCIe Gen2 revision 2. This surface-mount interface IC features a 324-pin CABGA package with a 1mm pin pitch, measuring 19mm x 19mm x 1.26mm. It offers 1 channel with a bandwidth of 5 Gbps per lane and a typical single supply voltage of 1V. Maximum power dissipation is 2.43W, with an operating temperature range of 0°C to 70°C.
PackageCABGA
MountingSurface Mount
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Technical Specifications
Renesas 89H10T4BG2ZBBCI technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CABGA
Package Description
Chip Array Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
19
Package Width (mm)
19
Package Height (mm)
1.26
Seated Plane Height (mm)
1.62
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
PCIe Generation
Gen2
Type
I/O Expansion Switch
PCIe Revision
2
Number of Lanes
10
Number of Ports
4
Number of Channels
1
Traffic Class
8
Bandwidth
5Gbps
Typical Single Supply Voltage
1V
Maximum Power Dissipation
2.43W
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
SAN34
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Renesas 89H10T4BG2ZBBCI Datasheet
Download the complete datasheet for Renesas 89H10T4BG2ZBBCI to view detailed technical specifications.
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