PCI Express Switch, 12 lanes, 3 ports, 1 channel, supporting PCIe Gen2 (Revision 2) with 5 Gbps bandwidth per lane. Features a 324-pin CABGA (Chip Array Ball Grid Array) package, surface mountable with a 1mm pin pitch, measuring 19x19x1.26mm. Operates with a typical single supply voltage of 1V and has a maximum power dissipation of 2.3W, suitable for 0°C to 70°C operating temperatures.
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Renesas 89H12T3BG2ZBBCI technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CABGA |
| Package Description | Chip Array Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 324 |
| PCB | 324 |
| Package Length (mm) | 19 |
| Package Width (mm) | 19 |
| Package Height (mm) | 1.26 |
| Seated Plane Height (mm) | 1.62 |
| Pin Pitch (mm) | 1 |
| Mounting | Surface Mount |
| PCIe Generation | Gen2 |
| PCIe Revision | 2 |
| Number of Lanes | 12 |
| Number of Ports | 3 |
| Number of Channels | 1 |
| Traffic Class | 8 |
| Bandwidth | 5Gbps |
| Typical Single Supply Voltage | 1V |
| Maximum Power Dissipation | 2.3W |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Cage Code | SAN34 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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