The 89H24NT24G2ZCHLGI8 is a 24-port Gen2 system interconnect switch from Renesas, packaged in a 324-pin Ball Grid Array (BGA) with a flip chip ball grid array configuration. It is designed for surface mount applications and features a plastic package with a maximum height of 2.42mm. The switch operates within a temperature range and meets the requirements of unspecified compliance standards.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 324 |
| PCB | 324 |
| Package Length (mm) | 19 |
| Package Width (mm) | 19 |
| Package Height (mm) | 2.42(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| PCIe Generation | Gen2 |
| Type | System Interconnect Switch |
| Number of Lanes | 24 |
| Number of Ports | 24 |
| Cage Code | SAN34 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Renesas 89H24NT24G2ZCHLGI8 to view detailed technical specifications.
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